An effective work/research proposal consists of the following elements:
ü Setting of work proposal工作提案建構 : 你工作提案的主題是什麼? 你的讀者可以明瞭工作提案的內容嗎?
ü Work problem工作問題 : 你的工作提案裡有你試著要解決或是想更進一步瞭解的問題嗎?
ü Quantitative specification of problem 問題的量化 : 你要如何量化問題來讓你的讀者明白之前文獻研究所遇到的量化限制 ?
ü Importance of problem問題的中心 : 如果問題沒被解決或是充分瞭解, 這對工作提案的讀者會有多大的負面衝擊?
ü Work objective工作目標 : 工作提案的目標 ?
ü Methodology to achieve objective 達成目標的方法 : 你的計劃中達成目標的步驟?
ü Anticipated results希望的結果 : 你希望達成的結果?
ü Contribution to field領域的貢獻: 你的提案對相關工作領域的貢獻?
Read the following work proposal from Writing Effective Work Proposals by Ted Knoy for a mechanical engineering-related (機械相關分類) project:
As well known, geometric parameters significantly affect the
[ ( xxv )
reliability of flip chip packaging under thermodynamic loading.
Based on the basic material mechanics, a higher solder joint
height implies a larger shear force that the solder joint can
bear. Moreover, several works have also concluded that cracks
occur in a solder joint when a package is under critical
thermodynamic loading. Furthermore, certain manufacturing
issues, such as packaging falling-off problems, solder bridging
and misalignment are also related to the design of the pad and
solder joint. However, geometric parameters of a C4 type
] [ ( v )
solder joint still can not accurately predict the reliability of flip
chip packaging under thermodynamic loading.. Indeed, many
engineers have tried to predict the geometric parameters of a
C4 type solder joint using an energy-based method and
analytical models. One of them simulated the C4 type solder
joint as a semi-spherical high-lead bump buried into the
eutectic solder; however the simulation lacks accuracy when the
external loading increases. Besides, the above methodology
ignores the effects of gravity. Moreover, the semi-spherical
high-lead bump can not simulate the high-lead bump when the
solder pad sizes vary. If the geometric parameters can not
] [ ( xx )
reach an accuracy of 5%, engineers can neither predict the
fatigue life nor enhance the yield of a flip chip package. Under
] [
these circumstances, engineers can not predict the correct
( x )
geometric parameters of a C4 type solder joint when the design
factors vary. Therefore, engineers can neither predict the
fatigue life nor enhance the yield of a flip chip package.
]
Based on the above, we should develop an analytical geometry
[ ( xv )
method capable of accurately predicting the geometric
parameters of practical C4 type solder joint in flip chip
technology after a reflow process. To do so, the differential
] [ ( xxxv )
equation of curvature can be derived from the well-known
Laplace-Young equation. Additionally, the contact angle between
the solder and substrate and the surface tension of the solder
can be measured. The free surface energy of the substrate and
the interfacial tension between the solder and the substrate
can then be obtained from Young's equation. Next, the
differential equation of curvature can be numerically solved to
obtain the geometric parameters. Moreover, the geometric data
of the solder joint can be used as an input in the finite element
model to analyze the stress/strain distribution, thermal fatigue
life and reliability of the electronic packages.
As anticipated, the proposed methodology can calculate the
[ ( xxxx )
effect of gravity on the buried high-lead solder bump instead of
on the semi-spherical one. Furthermore, the analytical geometry
method proposed herein can predict geometric parameters of a
C4 type solder joint to within 5% of those obtained by a specific
method found in the literature. The proposed method can
consider all of the design factors and can be used to investigate
how those factors affect the final shape of a C4 type solder
joint. Importantly, this study explores the effects of design
] [ ( xxxxv )
factors on the reliability of flip chip technology. The proposed
method can be used to design geometric parameters of a C4
type solder joint, capable of enhancing the reliability of a flip
chip package and reducing its stress concentration. Additionally,
the results of this study can enhance the reliability and fatigue
life of a flip chip package under thermodynamic loading.
Match the parts of a work proposal with the sentences in the above proposal.
1. Methodology to achieve objective 達成目標的方法 in the above proposal can be found in
A. v
B. xxxv
C. xv
2. Contribution to field領域的貢獻 in the above proposal can be found in
A. xxv
B. x
C. xxxxv
3. Work problem工作問題 in the above proposal can be found in
A. xxxx
B. v
4. Quantitative specification of problem 問題的量化 in the above proposal can be found in
A. xx
B. xxv
C. xxxx
5. Anticipated results希望的結果 in the above proposal can be found in
A. xxxxv
B. xx
6. Setting of work proposal工作提案建構 in the above proposal can be found in
A. xxxv
C. v
7. Work objective工作目標 in the above proposal can be found in
A. xv
8. Importance of problem問題的中心 in the above proposal can be found in
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